With the development of AI robots towards "miniaturization and high integration", the limitations of traditional high-frequency FCCL in thickness, weight, and functional integration are gradually emerging. The industry is promoting deep matching between high-frequency FCCL and robot design requirements through three major technological innovations.

The first is ultra-thin and lightweight. The internal space of the micro actuators of AI robots (such as finger joint drive modules) is narrow, requiring the thickness of the soft hard bonding plate to be controlled below 1mm, which requires a significant reduction in high-frequency FCCL thickness. At present, the industry has developed ultra-thin high-frequency FCCL with a total thickness of only 0.08mm (substrate thickness of 0.03mm+copper foil thickness of 0.025mm × 2), which reduces weight by 47% compared to traditional 0.15mm thick products. It can be directly embedded into micro modules, freeing up more space for battery or sensor expansion in the internal structure of robots. For example, a certain brand of miniature AI inspection robot uses ultra-thin high-frequency FCCL to reduce the volume of the control module by 30%, while achieving high-frequency transmission of high-definition images and motion commands.

The second is multifunctional integration. The single signal transmission function can no longer meet the integration requirements of AI robots, and high-frequency FCCL is gradually integrating heat dissipation and shielding functions. Some manufacturers embed ultra-thin graphene heat dissipation layers in high-frequency FCCL substrates, which can quickly conduct the heat generated by AI chips to the outside, reducing the working temperature of the chips by 10-15 ℃ and avoiding high temperature affecting high-frequency signal transmission; Another product adds a nano level shielding layer on the outer side of the copper foil, which can effectively isolate external electromagnetic interference (EMI), especially suitable for industrial scenarios where multiple robots work together to prevent signal crosstalk between different devices.

The third is customized structural design. In response to the differentiated needs of different parts of AI robots, high-frequency FCCL has begun to adopt an asymmetric structure of "local thickening+local ultra-thin". For example, in the rigid area of the soft hard bonding board, high-frequency FCCL with thickened copper foil (0.05mm) is used to enhance the chip's load-bearing capacity; In the flexible area, FCCL with ultra-thin substrate (0.02mm) is used to enhance bending reliability. This customized design not only ensures the quality of high-frequency signal transmission, but also meets the assembly requirements of complex robot structures.