Although high-frequency FCCL has broad application prospects in the field of AI robots, it still faces three major pain points: high cost, insufficient reliability, and difficult process adaptation. The industry is gradually finding solutions through technological innovation and industry chain collaboration.

Pain point one: The high cost of high-frequency FCCL restricts the popularization of mid to low end AI robots. The price of high-end substrates such as LCP is 3-5 times higher than that of traditional PI, resulting in high costs for soft hard bonding boards equipped with high-frequency FCCL. The solution is "substrate substitution+process optimization": on the one hand, research and development of modified PI substrates, by adding nano ceramic particles, can reduce Df to below 0.002, with performance close to LCP, but at only half of its cost; On the other hand, by optimizing the production process of high-frequency FCCL and adopting continuous rolling copper foil technology, the utilization rate of the substrate has been increased from 70% to 90%, further diluting the unit cost. At present, high-frequency FCCL using modified PI substrate has been widely applied in mid-range logistics AI robots, reducing robot hardware costs by 20%.

Pain point two: High frequency FCCL lacks reliability in harsh environments. When AI robots operate in industrial dust, humidity, high and low temperature environments, high-frequency FCCL is prone to substrate aging and copper foil corrosion, leading to signal transmission interruption. The solution is "surface modification+packaging protection": coating the surface of high-frequency FCCL with polytetrafluoroethylene (PTFE) waterproof coating, with a waterproof rating of up to IP67, effectively isolating moisture and dust; Nickel gold plating treatment is applied to copper foil to enhance its corrosion resistance, extending the performance stability period of high-frequency FCCL from 1 year to 3 years within the temperature range of -40 ℃ to 125 ℃. After adopting this solution, the equipment failure rate of a mining inspection AI robot decreased from 15% to below 3%.

Pain point three: The adaptation difficulty between high-frequency FCCL and soft hard bonding board technology is high. The processing characteristics of low loss substrates for high-frequency FCCL differ greatly from traditional substrates, and problems such as delamination and burrs are prone to occur during drilling, pressing, and other processes. The solution is "customized process parameters+equipment upgrade": for LCP substrate, adjust the drilling speed to 30000rpm to avoid substrate melting; Optimize the compression temperature and pressure curve, controlling the compression temperature 5-10 ℃ below the melting point of LCP to ensure a tight bond between the substrate and copper foil; At the same time, laser cutting equipment is introduced to replace traditional mold stamping, improve the processing accuracy of high-frequency FCCL, and reduce process defects. Through these measures, the yield of high-frequency FCCL's soft hard bonding board has increased from 65% to 92%.