The manufacturing process of FPC is an art of balancing flexibility and rigidity, which not only allows the circuit board to bend like paper, but also ensures the conductivity and reliability of the circuit. With the development of wearable devices, flexible displays, and other fields, the manufacturing process of FPC will continue to advance towards thinner (thickness<0.05mm) and more bending resistant (over 500000 times) directions. In the future, we may see circuits woven like fabric, making electronic devices truly ubiquitous.
As AI robots upgrade towards "smarter, more agile, and more reliable", technological innovation in flexible circuit boards (FPCs) is unfolding around three core directions, continuously breaking through application boundaries.
Listed below are printed circuit board assembly and PCB manufacturing capabilities. with everything you need to...
Listed below are printed circuit board assembly and PCB manufacturing capabilities. with everything you need to...
Listed below are printed circuit board assembly and PCB manufacturing capabilities. with everything you need to...
Listed below are printed circuit board assembly and PCB manufacturing capabilities. with everything you need to...
Listed below are printed circuit board assembly and PCB manufacturing capabilities. with everything you need to...
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