Against the backdrop of the continuously increasing demand for data transmission speed in AI robots, the performance of flexible copper-clad laminate (FCCL), as the core substrate of soft hard junction board (R-FPC), directly determines the transmission quality of high-frequency signals between the robot's "brain" and "limbs", becoming a key carrier to break through the bottleneck of signal delay.
The substrate of a regular rigid PCB is tightly bonded to copper foil, while the surface of the P substrate of FPC is smooth and requires special treatment to ensure that the copper foil adheres firmly. During pretreatment, the P1 film is first etched with a chemical solution (such as sodium hydroxide) to create tiny pits, then coated with a layer of adhesion promoter (similar to "glue"), and finally bonded to the substrate through hot pressing. An experiment conducted by a certain FPC factory showed that the adhesion of pre treated copper foil can reach 0.8N/mm, which is twice that of untreated copper foil, and copper detachment is less likely to occur when bent.
Listed below are printed circuit board assembly and PCB manufacturing capabilities. with everything you need to...
Listed below are printed circuit board assembly and PCB manufacturing capabilities. with everything you need to...
Listed below are printed circuit board assembly and PCB manufacturing capabilities. with everything you need to...
Listed below are printed circuit board assembly and PCB manufacturing capabilities. with everything you need to...
Listed below are printed circuit board assembly and PCB manufacturing capabilities. with everything you need to...
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